Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly ...

U.S. semiconductor companies were among the first to respond by disaggregating large chips into smaller, specialized chiplets ...

Apple has reportedly begun preliminary talks with Indian chipmakers to assemble and package iPhone components, according to a report by the Economic Times on Wednesday, citing sources familiar with ...