Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Using a standard parallel ATA interface and chip scale package-on-package technology, the Z-P140 PATA solid-state disk features a tiny 12 x 18 x 1.8 mm size, making it attractive for mobile products.

Maxim Integrated Products introduces the MAX16072-MAX16074 microprocessor supervisory circuits in a 1mm x 1mm chip-scale package Maxim Integrated Products introduces the MAX16072-MAX16074 ...

In a single chip-scale package (CSP) measuring only 1.4-mm in thickness, the company has managed to stack a PSRAM, one SRAM, and two flash memory chips, plus a spacer chip. Employing a proprietary ...

BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...