In southern Taiwan, suppliers once tied to steel, plastics, and display panels are pivoting toward chipmaking as booming AI demand and geopolitical risks push chipmakers to localize sourcing.

Lam Research powers AI chipmaking with leading etch/deposition tools and recurring service revenue. Click here to find out ...

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected. Save ...

Onto Innovation and Kulicke & Soffa both had a big year in 2022, but they're now down in the dumps. Despite a cyclical downturn, these two equipment makers look like they could have another surge of ...

TOKYO/SEOUL, March 31 (Reuters) - South Korea's Samsung Electronics Co Ltd (005930.KS), opens new tab is considering setting up a chip packaging test line in Japan, five people said, to bolster its ...

The news is coming from TheElec, with their sources saying Samsung's Advanced Package (AVP) team will be providing an interposer and I-Cube -- its 2.5D package -- to NVIDIA. Other companies will ...

China has made a major stride in semiconductor technology with the development of a ...

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...