A joint project to optimize injection molding using flow simulation data has produced actual process performance nearly identical to the modeled performance, according to Oerlikon HRSflow. The ...

Figure 1. (click to enlarge) Part-level flow simulation. The diversity and complexity of medical devices are likely to increase with time, as will the associated design risks and manufacturing ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...