Next-generation automotive systems are advancing beyond the limits of currently available technologies. The addition of advanced driver assistance systems (ADAS) and other advanced features requires ...
SAN JOSE, California — At the Open Compute Project (OCP) Summit today, Kushagra Vaid, general manager for Microsoft’s Azure hardware infrastructure, announced Project Denali. Its purpose is to create ...
Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...
Memory manufacturer SK Hynix has become the first company in the world to surpass 300 layers of NAND flash, marking an important milestone in developing high-density flash storage. The company ...
Cypress Semiconductor Corp. announced general availability of its USB host mass storage reference design kit (RDK) for embedded applications. The CY4640 hardware/software solution enables mass storage ...
Editor’s Note: NAND and NOR Flash memory play an integral role in embedded systems of all sorts but successful implementation requires careful attention to key ...
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