The Model 104A-1 Thermo-Probe probe tests components by applying pinpoint heat accurate to within ±1°C. Used to test devices such as diodes, resistors, and transistors, the probe takes seconds to heat ...

Hermes Testing Solutions Inc. (HTSI), a provider of semiconductor wafer testing solutions, said demand for flexible and highly customized testing equipment is increasing as advanced process nodes ...

IC test interface solution providers, which include probe cards and IC test sockets, are engaged in price negotiations with their fabless clients as demand for wireless devices falls, according to ...

The semiconductor industry is changing rapidly, with one of the biggest developments being the move from traditional pogo-based die probing to photonic beam probing for Very-Large-Scale Integration ...

Test facilities are beginning to implement real-time maintenance, rather than scheduled maintenance, to reduce manufacturing costs and boost product yield. Adaptive cleaning of probe needles and test ...

During standardized chip fabrication, integrate circuit (IC) testing is conducted repeatedly to inspect the chips once they are manufactured. IC testing begins with wafer penetration before etched ...

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

Vijay Sontakke, who works at Intel Corporation as a design engineer, has emerged as a key contributor to the field of semiconductor testing. He has 24 years of experience in semiconductor testing. His ...