Silicon metasurfaces boost optical image processing with passive intensity-based filtering

Of the many feats achieved by artificial intelligence (AI), the ability to process images quickly and accurately has had an ...
University of Dayton

Signal and Image Processing Lab

UD's Signal and Image Processing Lab is designed to support graduate and undergraduate research in the areas of signal and image processing. The lab provides office space for graduate students and has ...
Semiconductor Engineering

Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate

In the recent semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting and ...
Semiconductor Engineering

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...