Micron has now entered the HBM3 race by introducing a “second-generation” HBM3 DRAM memory stack, fabricated with the company’s 1β semiconductor memory process technology, which the company announced ...

If the HPC and AI markets need anything right now, it is not more compute but rather more memory capacity at a very high bandwidth. We have plenty of compute in current GPU and FPGA accelerators, but ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...