NEWARK, Del, Aug. 11, 2022 (GLOBE NEWSWIRE) -- The end-of-line packaging market was valued at US$ 5.125 billion in 2022, and it is expected to grow at a CAGR of 4.3% to US$ 7.978 billion by 2032. The ...

WASHINGTON, Jan. 30, 2023 (GLOBE NEWSWIRE) -- The Global End-of-Line Packaging Market is valued at USD 5.5 Billion in 2021 and is projected to reach a value of USD 6.8 Billion by 2028 at a CAGR ...

Harpak-ULMA Packaging, PTC and Rockwell Automation partner to demonstrate the power of augmented reality for human productivity and downtime avoidance BOSTON--(BUSINESS WIRE)--Harpak-ULMA and Rockwell ...

Samsung Electronics is not only the first company in the world to launch a labor-free semiconductor packaging line, but it has also set a goal of converting its packaging plants to be human labor-free ...

The new line brings the entire manufacturing process onto a single site, which is expected to streamline logistics.

Some of the most promising innovations in packaging are helping bakers and snack makers address the problems they’re having in their facilities.