A line scan camera from Teledyne Dalsa provides spectrally independent RGB and NIR outputs to detect defects on and under the surface. The Linea ML 8k multispectral camera can be used for examining a ...
Whether the discussion is about smart manufacturing or digital transformation, one of the biggest conversations in the semiconductor industry today centers on the tremendous amount of data fabs ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
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