Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

From solar energy optimization to infection-fighting medical devices, AltaSim Technologies is transforming product ...

Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...

Overview: Mechanical engineers depend on integrated CAD, CAE, and CAM tools to design, evaluate, and refine complex systems.

Simulate satellite thermal behavior in orbit. Explore how a Monte Carlo model demonstrates temperature changes as it moves ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

29% of thermal engineers are having to compromise the accuracy of their simulations due to hardware limitations, according to The State of Thermal, a survey of over 170 thermal engineers conducted by ...

Thanks to MSC Software you can now download a free thermal simulation tool, PICLS Lite, via the Electronics Weekly website. It could represent a saving of hundreds of pounds, and means anyone can ...

With concerns over air pollution and petroleum supplies, the use of hybrid electric vehicles (HEVs) and electric vehicles (EVs) have come to the forefront as alternatives to conventional gasoline and ...