System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...

Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...

SE: Why is applying functional test content so challenging today? Ruiz: There are a couple of different factors that make successfully applying functional patterns on the tester a challenge. In fact, ...

With the proliferation of fiber-optic products containing interfaces ranging from Gigabit Ethernet to 10-Gbps SONET, the demand for optical testing capabilities is high. Unfortunately, so is the cost ...