In the age of Industry 4.0, manufacturers are expected to develop increasingly sophisticated, digitally integrated products while controlling development costs and accelerating time to market.

Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...

Abstract: Angular momenta of electromagnetic waves are important both in concepts and applications. In this work, we systematically discuss two types of angular momenta, i.e., spin angular momentum ...