The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as ...
The industry’s response is to split compute, memory, and I/O across dies, XPU chiplets are pushing toward the reticle limit, and stitch it all together with high‑bandwidth, energy‑efficient die‑to‑die ...
Kalinagaswamy: Both have their own challenges. Scale-up may have hundreds of GPUs or accelerators, and they have to work in a scale-up network. Scale-out is point-to-point. They cannot make that many ...
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