The Dragon Q6A SBC packs Qualcomm QCS6490 with 12 TOPS AI and Wi-Fi 6, giving faster edge apps and smoother 4K playback for ...

SK hynix unveiled its next generation of artificial intelligence memory chips, including a 16-layer HBM4, at CES 2026 in Las Vegas on Tuesday. The chipmaker opened a customer-only exhibition booth to ...

SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...

SK Hynix will unveil a lineup of next-generation high-bandwidth memory (HBM) products at CES2026. The company, which holds ...

SK hynix said Tuesday it is unveiling its next generation of artificial intelligence memory chips — including a 16-layer HBM4 ...

In addition to updated Ryzen AI 300 series processors and the new Ryzen AI 400 series unveiled at CES 2026, the company ...

SK hynix Inc. (or "the company", announced today that it will open a customer exhibition booth at Venetian Expo and showcase ...

TrendForce is a global provider of the latest development, insight, and analysis of the technology industry. Having served businesses for over a decade, the comp ...

CES attendees are invited to experience Patriot Memory's latest memory and storage technologies January 6–9, 2026, in Las ...

In the realm of industrial memory modules, ADATA launches the DDR5 ECC CU-DIMM and CSO-DIMM 7200, utilizing a PMIC (Power ...