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3:55
YouTube
DuPont
Introduction to Chemical Mechanical Planarization/Polishing (CMP) in Semiconductor Fabrication
Chemical mechanical planarization (or polishing), or CMP, is a critical step that is used multiple times in the semiconductor manufacturing process at each layer of the wafer to remove excess materials and create a smooth surface. This is done through the interaction of a pad and slurry on a polishing tool. Pads and slurries are consumables ...
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May 14, 2024
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